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Hierarchical stochastic analysis process optimization for integrated circuit design and manufacture

机译:集成电路设计和制造的分层随机分析过程优化

摘要

An Integrated Circuit Design tool incorporating a Stochastic Analysis Process (“SAP”) is described. The SAP can be applied on many levels of circuit components including transistor devices, logic gate devices, and System-on-Chip or chip designs. The SAP replaces the large number of traditional Monte Carlo simulations with operations using a small number of sampling points or corners. The SAP is a hierarchical approach using a model fitting process to generate a model that can be used with any number of performance metrics to generate performance variation predictions along with corresponding statistical information (e.g., mean, three-sigma probability, etc.). A hierarchical SAP process breaks an overall circuit into a plurality of subcircuits and performs circuit simulation and SAP analysis steps on each subcircuit. An integration and reduction process combines the analysis results of each subcircuit, and a final SPICE/SAP process provides a model for the overall circuit based on the subcircuits.
机译:描述了结合了随机分析过程(“ SAP”)的集成电路设计工具。 SAP可以应用于许多级别的电路组件,包括晶体管设备,逻辑门设备以及片上系统或芯片设计。 SAP通过使用少量采样点或拐角的操作来代替大量传统的蒙特卡洛模拟。 SAP是使用模型拟合过程来生成模型的分层方法,该模型可与任何数量的性能指标一起使用以生成性能变化预测以及相应的统计信息(例如,均值,三西格玛概率等)。分层的SAP过程将整个电路分解为多个子电路,并在每个子电路上执行电路仿真和SAP分析步骤。集成和归约过程结合了每个子电路的分析结果,最终的SPICE / SAP过程为基于子电路的整个电路提供了模型。

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