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Dielectric particle aggregate, low-temperature sintered dielectric ceramic composition using the same, and low-temperature sintered dielectric ceramic manufactured using the same
Dielectric particle aggregate, low-temperature sintered dielectric ceramic composition using the same, and low-temperature sintered dielectric ceramic manufactured using the same
By blending 2.5 to 20 parts by weight of a glass component with respect to 100 parts by weight of an aggregate of dielectric particles made of a dielectric containing Ti and containing an oxide containing Ti and Zn in the surface layer part. A low temperature sintered dielectric ceramic composition is provided. This low-temperature sintered dielectric ceramic composition is fired at 880 to 1000 ° C. to produce a low-temperature sintered dielectric ceramic. Thereby, the multilayer structure electronic component which has an internal conductor which consists of an alloy containing Ag and Cu or at least one of these can be provided.
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