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SPLINE SHAFT, HEAT TREATMENT METHOD AND HEAT TREATMENT APPARATUS

机译:花键轴,热处理方法和热处理装置

摘要

PPROBLEM TO BE SOLVED: To provide a heat treatment method for a spline shaft having a stepped part formed therein. PSOLUTION: When induction-hardening the spline shaft 200, this heat treatment method includes induction-heating a large-diameter part 250 only with a low-frequency wave and a spline part 210 with a combined wave of the low-frequency wave and a high-frequency wave, respectively. In this way, the method can appropriately heat each of a rising part 251, a tooth bottom 212 and a tooth top 211, and can form a hardened layer 270 having predetermined hardness down to sufficient depth on each of these parts. Here, the spline shaft is heated in a fixed position or while moving, with the low-frequency wave. Thereby, the large-diameter part 250 is not damaged by overheat, but is heated down to appropriate depth as well as a corner part 251R of the bottom of the rising part 251. In addition, in a step of supplying two waves of different frequencies to the spline part, which starts after an induction heating coil has passed through the rising part 251, the tooth bottom 212 is heated with the low-frequency wave and the tooth top 211 is heated with the high-frequency wave, so that the whole surface of the spline part 210 can be heated down to the appropriate depth. PCOPYRIGHT: (C)2008,JPO&INPIT
机译:<要解决的问题:提供一种用于花键轴的热处理方法,该花键轴具有在其中形成的台阶部分。

解决方案:在对花键轴200进行感应淬火时,该热处理方法包括仅通过低频波感应加热大直径部分250和通过低频波的组合波感应加热花键部分210。和高频波。这样,该方法可以适当地加热立起部分251,齿根212和齿顶211中的每一个,并且可以在这些部分的每一个上形成具有预定硬度的硬化层270,所述硬化层270具有足够的深度。此处,花键轴在固定位置或移动时通过低频波加热。从而,大直径部分250不会由于过热而损坏,而是被加热到上升部分251的底部的拐角部分251R以及下降到适当的深度。另外,在提供两个不同频率的波的步骤中在感应加热线圈已经通过上升部分251之后开始的花键部分上,齿底部212被低频波加热,齿顶211被高频波加热,从而整体花键部分210的表面可以被加热到适当的深度。

版权:(C)2008,日本特许厅&INPIT

著录项

  • 公开/公告号JP2008169454A

    专利类型

  • 公开/公告日2008-07-24

    原文格式PDF

  • 申请/专利权人 HIGH FREQUENCY HEATTREAT CO LTD;

    申请/专利号JP20070006145

  • 发明设计人 TANAKA YOSHIMASA;MISAKA YOSHITAKA;

    申请日2007-01-15

  • 分类号C21D9/28;C21D1/10;C21D1/667;H05B6/10;H05B6/06;

  • 国家 JP

  • 入库时间 2022-08-21 20:24:12

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