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RESIN COMPOSITION FOR BUILD-UP FILM-INSULATING LAYER, ITS CURED PRODUCT, AND BUILD-UP FILM

机译：用于增透膜绝缘层的树脂组合物，其固化产品和增透膜

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摘要

PPROBLEM TO BE SOLVED: To provide a resin composition for build-up film insulating layers, which gives cured products having remarkably low linear expansion coefficients and is excellent in film dimensional stability, when used as a material for the build-up film insulating layers, and to provide a build-up film excellent in dimensional stability. PSOLUTION: This resin composition for the build-up film insulating layers is characterized by comprising an epoxy resin (A) having a 2,4'-bis(oxyphenylene)sulfone structure represented by general formula 1 in the molecular structure, and a curing agent (B) as essential components. PCOPYRIGHT: (C)2008,JPO&INPIT

机译：

要解决的问题：提供用于堆积膜绝缘层的树脂组合物，当用作堆积膜的材料时，其提供的固化产物具有非常低的线性膨胀系数并且膜尺寸稳定性优异。绝缘层，并提供尺寸稳定性优异的积层膜。

解决方案：该用于覆膜绝缘层的树脂组合物的特征在于，包括在分子结构中具有由通式1表示的2,4'-双（氧亚苯基）砜结构的环氧树脂（A），和作为必需成分的固化剂（B）。

版权：（C）2008，日本特许厅＆INPIT 展开▼

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公开/公告号JP2008150495A

专利类型
公开/公告日2008-07-03

原文格式PDF
申请/专利权人 DIC CORP;
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申请/专利号JP20060339918
发明设计人 MORINAGA KUNIHIRO;OGURA ICHIRO;
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申请日2006-12-18
分类号C08G59/30;H01B3/40;H05K3/46;B32B27/38;B32B7/02;B32B25/08;B32B27/20;
国家 JP
入库时间 2022-08-21 20:24:38

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