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Electronic component e.g. power component, soldering method for electronic module, involves positioning electronic component on printed circuit board and fusing solder joint by circulating electric current in pins of component to heat pins
Electronic component e.g. power component, soldering method for electronic module, involves positioning electronic component on printed circuit board and fusing solder joint by circulating electric current in pins of component to heat pins
The method involves positioning an electronic component e.g. power component, on a printed circuit board by interposing a solder joint (8) between connection pins (7) of the electronic component and the printed circuit board. The solder joint is fused by circulating electric current in the pins of the component for heating the pins. Two electrodes (51) are applied on each pin, such that the electric current is circulated between the electrodes. An independent claim is also included for a production line of electronic modules.
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