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Integrated fuel cell support plate e.g. multilayer printed circuit board, has silicon wafer with front side carrying active fuel cell stack, and recess, formed on rear side of plate, on which channels or perforations emerge out
Integrated fuel cell support plate e.g. multilayer printed circuit board, has silicon wafer with front side carrying active fuel cell stack, and recess, formed on rear side of plate, on which channels or perforations emerge out
The plate has a silicon wafer (21) with a front side carrying an active fuel cell stack opposite to a perforated zone. Channels or perforations (23) emerge out on a recess (22) formed on a rear side of the plate. A protection layer is formed on the rear side and comprises an opening. The protection layer is formed at the same time as that of a channel covering layer e.g. silicon oxide layer, formed on walls of the channels. The wafer has a thickness of 300 micrometer for the depth of the recess of the order of 100 to 200 micrometer. Independent claims are also included for the following: (1) a method for manufacturing a fuel cell support plate (2) an assembly of fuel cells.
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