首页> 外国专利> Opto-electronic semiconductor chip e.g. light emitting diode chip, has contact layer, where electrical contact resistance of contact layer to connection layer is smaller than contact layer to barrier layer

Opto-electronic semiconductor chip e.g. light emitting diode chip, has contact layer, where electrical contact resistance of contact layer to connection layer is smaller than contact layer to barrier layer

机译:光电半导体芯片发光二极管芯片具有接触层,其中接触层与连接层的接触电阻小于接触层与阻挡层的接触电阻

摘要

The semiconductor chip has a contact layer (6) extended over a barrier layer (5) and over a connection layer (4) of a semiconductor layer sequence. The contact layer is connected with an active area in an electrically conducting manner over a connection area (7) of the connection layer. An electrical contact resistance of the contact layer to the connection layer is smaller than an electrical contact resistance of the contact layer to the barrier layer. The contact layer within a barrier area (8) is bordered on the barrier layer. An independent claim is also included for a method for manufacturing a contact structure for an opto-electronic semiconductor chip for generating radiation.
机译:半导体芯片具有在阻挡层(5)和半导体层序列的连接层(4)上延伸的接触层(6)。接触层在连接层的连接区域(7)上以导电方式与有源区域连接。接触层与连接层的电接触电阻小于接触层与阻挡层的电接触电阻。阻挡区域(8)内的接触层在阻挡层上接界。还包括一种用于制造用于产生辐射的光电半导体芯片的接触结构的方法的独立权利要求。

著录项

  • 公开/公告号DE102006034847A1

    专利类型

  • 公开/公告日2007-10-31

    原文格式PDF

  • 申请/专利权人 OSRAM OPTO SEMICONDUCTORS GMBH;

    申请/专利号DE20061034847

  • 发明设计人 ILLEK STEFAN;

    申请日2006-07-27

  • 分类号H01L33;H01L23/48;H01L21/44;

  • 国家 DE

  • 入库时间 2022-08-21 20:29:14

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