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Printed circuit board for measuring device of industrial measuring technique and automation, has pre-shaped filler inserted in contact surfaces, where filler forms non-conducting bridging of contact surfaces in reflow-soldering furnace
Printed circuit board for measuring device of industrial measuring technique and automation, has pre-shaped filler inserted in contact surfaces, where filler forms non-conducting bridging of contact surfaces in reflow-soldering furnace
The circuit board (50) has two contact surfaces (54,1, 54.2) that are connected alternatively, and an adhesive (58) applied in proximity to the contact surfaces, where the adhesive is placed between the contact surfaces on the circuit board. A pre-shaped filler (56) is inserted in the contact surfaces, and has a higher melting point than a soldering paste, where the filler forms non-conducting bridging of the contact surfaces in a reflow-soldering furnace. An independent claim is also included for a method for soldering components inserted in a soldering paste on a printed circuit board.
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