首页> 外国专利> Substrate used for structuring wafers in the semiconductor industry comprises a shaping layer arranged on the substrate body and made from a material having a melting point less than the melting point of contact connections

Substrate used for structuring wafers in the semiconductor industry comprises a shaping layer arranged on the substrate body and made from a material having a melting point less than the melting point of contact connections

机译：用于半导体工业中的晶片结构化的基板包括设置在基板主体上的成型层，该成型层由熔点小于接触连接的熔点的材料制成

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摘要

Substrate (2) comprises a shaping layer (9) arranged on the substrate body (1) and made from a material having a melting point less than the melting point of contact connections (10). Independent claims are also included for the following: (1) Combination of a substrate and a wafer with contact connections; and (2) method for handling a substrate.

机译：基板（2）包括布置在基板主体（1）上的并且由熔点小于接触连接（10）的熔点的材料制成的成形层（9）。还包括以下方面的独立权利要求：（1）具有接触连接的衬底和晶片的组合; （2）处理基板的方法。

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公开/公告号DE102005051346A1

专利类型
公开/公告日2007-05-03

原文格式PDF
申请/专利权人 THALLNER ERICH;
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申请/专利号DE20051051346
发明设计人 THALLNER ERICH;
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申请日2005-10-25
分类号H01L21/67;H01L21/58;
国家 DE
入库时间 2022-08-21 20:29:39

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