首页> 外国专利> A SYSTEM FOR CONTROLLING POST-PROCESSING TOPOLOGY OF SEMICONDUCTOR WAFERS, A METHOD OF CONTROLLING A CHEMICAL MECHANICAL POLISHING SYSTEM, A FUZZY LOGIC CONTROL FUNCTION FOR A CHEMICAL MECHANICAL POLISHING SYSTEM, AND A SEMICONDUCTOR DEVICE PRODUCED BY THE METHOD

A SYSTEM FOR CONTROLLING POST-PROCESSING TOPOLOGY OF SEMICONDUCTOR WAFERS, A METHOD OF CONTROLLING A CHEMICAL MECHANICAL POLISHING SYSTEM, A FUZZY LOGIC CONTROL FUNCTION FOR A CHEMICAL MECHANICAL POLISHING SYSTEM, AND A SEMICONDUCTOR DEVICE PRODUCED BY THE METHOD

机译：用于控制半导体晶片的后处理拓扑的系统，控制化学机械抛光系统的方法，用于化学机械抛光系统的模糊逻辑控制功能以及由该方法生产的半导体装置

页面导航

摘要
著录项
相似文献

摘要

The present invention provides a versatile system for controlling chemical mechanical polishing in a semiconductor manufacturing process. The system of the present inventions utilizes an in-situ chemical mechanical polishing system, having some type of measurement or metrology function, to bulk polish a semiconductor wafer to a first target threshold. Once the first target has been reached, a fuzzy logic control function, communicatively coupled to the in-situ chemical mechanical polishing system, takes control of further polishing. Measurement data from the measurement function is processed by the fuzzy logic control function, which then adjusts additional polishing time for the polishing system to render a desired wafer topography.

机译：本发明提供了一种用于控制半导体制造过程中的化学机械抛光的通用系统。本发明的系统利用具有某种类型的测量或计量功能的原位化学机械抛光系统来将半导体晶片整体抛光至第一目标阈值。一旦达到第一个目标，与现场化学机械抛光系统通信耦合的模糊逻辑控制功能就可以控制进一步的抛光。来自测量功能的测量数据由模糊逻辑控制功能处理，该功能随后为抛光系统调整额外的抛光时间，以呈现所需的晶圆形貌。

著录项

公开/公告号KR20070045904A

专利类型
公开/公告日2007-05-02

原文格式PDF
申请/专利权人 SAMSUNG ELECTRONICS CO. LTD.;
展开▼

申请/专利号KR20060085868
发明设计人 SUGENTO HUANDRA;
展开▼

申请日2006-09-06
分类号H01L21/304;
国家 KR
入库时间 2022-08-21 20:35:29

相似文献

专利
外文文献
中文文献