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ELECTRIC QUALITY PROSECUTING ATTORNEY SYSTEM COMBINATION GUN MING SYSTEM
ELECTRIC QUALITY PROSECUTING ATTORNEY SYSTEM COMBINATION GUN MING SYSTEM
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机译:电能质量代理律师制度组合枪械制度
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摘要
An apparatus for testing and packaging a semiconductor device is provided to improve manufacturing yield of the semiconductor device by performing testing and packaging processes at the same time. An apparatus for testing and packaging a semiconductor device includes a supply unit, a transfer unit, an inspecting unit, an ejector, a forming unit, and a container box. A semiconductor package(1) is supplied by vibration of the supply unit. The supply unit includes a motor, which is installed at the bottom center of a container room(11). The semiconductor package is delivered to the transfer unit via the container room. The semiconductor package is transferred through respective grooves, which are formed on a gripper. The inspecting unit applies an excessive voltage or an excessive current to the semiconductor package and tests the operation of the semiconductor package. A defective semiconductor package is delivered to the ejector, which includes a pair of ejecting tips at one side of the rail. An ejecting cap is opened by a pressure from the ejecting tips, so that the defective semiconductor package is ejected.
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