首页> 外国专利> ELECTRIC QUALITY PROSECUTING ATTORNEY SYSTEM COMBINATION GUN MING SYSTEM

ELECTRIC QUALITY PROSECUTING ATTORNEY SYSTEM COMBINATION GUN MING SYSTEM

机译:电能质量代理律师制度组合枪械制度

摘要

An apparatus for testing and packaging a semiconductor device is provided to improve manufacturing yield of the semiconductor device by performing testing and packaging processes at the same time. An apparatus for testing and packaging a semiconductor device includes a supply unit, a transfer unit, an inspecting unit, an ejector, a forming unit, and a container box. A semiconductor package(1) is supplied by vibration of the supply unit. The supply unit includes a motor, which is installed at the bottom center of a container room(11). The semiconductor package is delivered to the transfer unit via the container room. The semiconductor package is transferred through respective grooves, which are formed on a gripper. The inspecting unit applies an excessive voltage or an excessive current to the semiconductor package and tests the operation of the semiconductor package. A defective semiconductor package is delivered to the ejector, which includes a pair of ejecting tips at one side of the rail. An ejecting cap is opened by a pressure from the ejecting tips, so that the defective semiconductor package is ejected.
机译:提供了一种用于测试和封装半导体器件的设备,以通过同时执行测试和封装工艺来提高半导体器件的制造成品率。用于测试和封装半导体器件的设备包括供应单元,转移单元,检查单元,弹出器,形成单元和容器盒。通过供应单元的振动来供应半导体封装(1)。供应单元包括马达,马达安装在集装箱室(11)的底部中心。半导体封装经由容器室被传送到转移单元。半导体封装通过形成在夹具上的相应的凹槽被传送。检查单元向半导体封装施加过大的电压或过大的电流,并测试半导体封装的操作。有缺陷的半导体封装被交付到弹出器,该弹出器在导轨的一侧包括一对弹出尖端。通过来自弹出尖端的压力打开弹出盖,从而弹出有缺陷的半导体封装。

著录项

  • 公开/公告号KR20060132316A

    专利类型

  • 公开/公告日2006-12-21

    原文格式PDF

  • 申请/专利权人 KODENSHI KOREA CORP.;

    申请/专利号KR20050052603

  • 发明设计人 YANG WOONG IL;

    申请日2005-06-17

  • 分类号G01R31/26;G01R31/28;H01L21/66;

  • 国家 KR

  • 入库时间 2022-08-21 20:42:07

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