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DEEP ULTRAVIOLET LIGHT EMITTING DEVICES AND METHODS OF FABRICATING DEEP ULTRAVIOLET LIGHT EMITTING DEVICES

机译:深紫外发光装置以及制造深紫外发光装置的方法

摘要

Light emitting devices and methods of fabricating light emitting devices that emit at wavelengths less than 360 nm with wall plug efficiencies of at least 4 % are provided. Wall plug efficiencies may be at least 5 % or at least 6 %. Light emitting devices and methods of fabricating light emitting devices that emit at wavelengths less than 345 nm with wall plug efficiencies of at least 2 % are also provided. Light emitting devices and methods of fabricating light emitting devices that emit at wavelengths less than 330 nm with wall plug efficiencies of at least 0.4 % are provided. Light emitting devices and method of fabricating light emitting devices having a peak output wavelength of not greater than 350 nm and an output power of at least 5 mW, having a peak outpu wavelength of 345 nm or less and an output power of at least 3 mW and/or a peak output wavelength of 330 nm or less and an output power of at least 0.3 mW at a current density of less than about 0.35 μA/μm2 are also provided. The semiconductor light emitting devices may have a direct current lifetime of at least 100 hours, at least 500 hours or at least 1000 hours.
机译:提供了发光器件和制造发光器件的方法,该发光器件以小于4nm的壁塞效率发射小于360nm的波长。墙上插头的效率可能至少为5%或至少为6%。还提供了发光器件和制造发光器件的方法,该发光器件以小于25%的壁塞效率发射波长小于345 nm的波长。提供了发光器件和制造发光器件的方法,该发光器件发射波长小于330 nm且壁塞效率至少为0.4%的发光器件。峰值输出波长不大于350nm且输出功率至少为5mW,峰值输出波长为345nm或更小且输出功率至少为3mW的发光器件及其制造方法在电流密度小于约0.35μA/μm2的情况下,还提供和/或330nm或更小的峰值输出波长和至少0.3mW的输出功率。半导体发光器件可以具有至少100小时,至少500小时或至少1000小时的直流寿命。

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