首页> 外国专利> ESD protection structure and method utilizing substrate triggering for a high-voltage tolerant pad

ESD protection structure and method utilizing substrate triggering for a high-voltage tolerant pad

机译:利用衬底触发的耐高压焊盘的ESD保护结构和方法

摘要

In an ESD protection structure and method utilizing substrate triggering for a high-voltage tolerant pad on a substrate, an ESD protection device has a source connected to the pad and a gate and a drain both connected to a ground, and a substrate-triggering control circuit is used to keep the substrate at a low voltage during a normal operation, and pumping the substrate to a high voltage during an ESD event for the ESD protection device to be triggered much easier. The substrate-triggering control circuit is implemented with an active device, thereby reducing the chip size for the circuit and the loading effect on the pad.
机译:在利用衬底触发来在衬底上的耐高压焊盘的ESD保护结构和方法中,ESD保护装置具有连接到焊盘的源极和都接地的栅极和漏极以及衬底触发控制。电路用于在正常操作期间将衬底保持在低电压,并在ESD事件期间将衬底泵送到高电压,以使ESD保护器件更容易触发。衬底触发控制电路由有源器件实现,从而减小了电路的芯片尺寸并减小了焊盘上的负载效应。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号