首页> 外国专利> Defect information detection sensitivity data determination method, defect information detection sensitivity data determination device, defect detection device management method, semiconductor device defect detection method, and semiconductor device defect detection device

Defect information detection sensitivity data determination method, defect information detection sensitivity data determination device, defect detection device management method, semiconductor device defect detection method, and semiconductor device defect detection device

机译:缺陷信息检测灵敏度数据确定方法,缺陷信息检测灵敏度数据确定设备,缺陷检测设备管理方法,半导体器件缺陷检测方法和半导体器件缺陷检测设备

摘要

A method of determining defect detection sensitivity data, comprises: taking image data from the desired surface areas of each of semiconductor devices, processing at least two of the image data through arithmetic operations and comparing the processed image data with a parameter of defect detection sensitivity substituted by predetermined threshold data to obtain information on defects in the desired areas at least in one-to-one correspondence with any of the image data arithmetically processed, repeating more than once the step of varying the parameter of the defect detection sensitivity to obtain the defect information, so as to obtain more than one sets of combination data on a value of the parameter of the defect detection sensitivity correlated with the defect information, processing more than one sets of the combination data to produce a mathematical function expressing a relation of the desired statistical data with the parameter of the defect detection sensitivity, the mathematical function being used to determine defect detection sensitivity data, the defect detection sensitivity data being used in obtaining the information on the defects in the desired surface areas of the semiconductor devices under defect inspection, and the defect detection sensitivity data defining an existence range of the defect information in the image data which are taken from the desired surface areas of each semiconductor device and which are arithmetically processed in the previous step.
机译:一种确定缺陷检测灵敏度数据的方法,包括:从每个半导体器件的期望表面积中获取图像数据;通过算术运算处理至少两个图像数据;以及将处理后的图像数据与替换为缺陷检测灵敏度的参数进行比较。通过预定的阈值数据,至少与经过算术处理的任何图像数据一一对应地获得所需区域中的缺陷信息,重复多次改变缺陷检测灵敏度参数以获得缺陷的步骤信息,以便获得与缺陷信息相关的缺陷检测灵敏度的参数值的多于一组的组合数据,处理多于一组的组合数据以产生表示期望关系的数学函数带有缺陷检测灵敏度,数学参数的统计数据该功能用于确定缺陷检测灵敏度数据,该缺陷检测灵敏度数据用于获得关于缺陷检查下的半导体器件的期望表面中的缺陷的信息,并且该缺陷检测灵敏度数据定义了缺陷检测灵敏度数据的存在范围。从每个半导体器件的所需表面区域获取的图像数据中的缺陷信息,这些缺陷信息在先前的步骤中经过了算法处理。

著录项

  • 公开/公告号JP3848236B2

    专利类型

  • 公开/公告日2006-11-22

    原文格式PDF

  • 申请/专利权人 株式会社東芝;

    申请/专利号JP20020305157

  • 发明设计人 濱 口 晶;永 井 隆 光;

    申请日2002-10-18

  • 分类号G01N21/956;G01B11/30;G06T1;H01L21/66;

  • 国家 JP

  • 入库时间 2022-08-21 21:07:41

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