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首页> 外国专利> WIRING BOARD FOR DYNAMIC QUANTITY SENSOR, MANUFACTURING METHOD OF THE WIRING BOARD FOR DYNAMIC QUANTITY SENSOR, AND DYNAMIC QUANTITY SENSOR

WIRING BOARD FOR DYNAMIC QUANTITY SENSOR, MANUFACTURING METHOD OF THE WIRING BOARD FOR DYNAMIC QUANTITY SENSOR, AND DYNAMIC QUANTITY SENSOR

机译：动态量传感器的接线板，动态量传感器的接线板的制造方法以及动态量传感器

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摘要

PPROBLEM TO BE SOLVED: To provide a miniaturizable dynamic quantity sensor having a simple structure. PSOLUTION: A taper-shaped through hole is formed by using a sandblasting technique on a portion where a via hole of a planar upper glass substrate is formed. Then, an electrode pad, a wiring pattern, and a conductive pattern for extracting the electric potential to the inner wall surface of the through hole are formed. Successively, a filling member, having conductivity such as solder or Ag-based brazing material, is filled by heating inside the through hole where the conductive pattern is formed. Then, the upper glass substrate is polished to such a level that the filling member is exposed. An electrode is formed on the polished surface. After performing an anode junction between the upper glass substrate and a movable part structure, a conductive pattern for taking out an electric potential of the movable part structure is formed. A wiring pattern can be suppressed to a minimum, by forming the electrode directly under the via hole in this way, to thereby miniaturize the sensor. PCOPYRIGHT: (C)2007,JPO&INPIT
机译：

要解决的问题：提供一种具有简单结构的可小型化的动态量传感器。

解决方案：通过使用喷砂技术在形成平面上玻璃基板的通孔的部分上形成锥形通孔。然后，形成用于将电势提取到通孔的内壁表面的电极焊盘，布线图案和导电图案。接着，通过在形成导电图案的通孔内部进行加热，来填充具有导电性的填充材料，例如焊料或基于Ag的钎焊材料。然后，将上玻璃基板抛光至露出填充构件的水平。在抛光表面上形成电极。在上玻璃基板和可移动部件结构之间进行阳极接合之后，形成用于取出可移动部件结构的电势的导电图案。通过以这种方式在通孔正下方形成电极，可以将布线图案抑制到最小，从而使传感器小型化。

版权：（C）2007，日本特许厅＆INPIT

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