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Electronic component e.g. vertical cavity surface emitting laser, assembly for use in microelectronic field, has flip chips transferring electrical signals between component and substrate, and heat from component to substrate
Electronic component e.g. vertical cavity surface emitting laser, assembly for use in microelectronic field, has flip chips transferring electrical signals between component and substrate, and heat from component to substrate
The assembly has an electronic component (108) connected to a silicon substrate (106) acting as a heat sink, through flip chips (107). The flip chips are connected to electrically-conducting lines on the component and to electrically-conducting lines on the substrate. The flip chips transfer electrical signals between the component and the substrate, and heat from the component to the substrate. An independent claim is also included for a method of assembling an electronic component.
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