首页> 外国专利> Heat sink for e.g. north bridge chip, has housing and heat contact layer provided between upper surface of chip and lower surface of housing, where housing is made of heat conducting material having metal and crystalline carbon

Heat sink for e.g. north bridge chip, has housing and heat contact layer provided between upper surface of chip and lower surface of housing, where housing is made of heat conducting material having metal and crystalline carbon

机译：散热器例如北桥芯片，具有外壳和设置在芯片上表面与外壳下表面之间的热接触层，其中外壳由具有金属和结晶碳的导热材料制成

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摘要

The heat sink has a base plate with an upper surface connected with a lower surface of a chip. A housing (15) has upper and lower surfaces, whereby the lower surface abuts on four side surfaces. The side surfaces abut on base surfaces. A heat contact layer is provided between the upper surface of the chip and the lower surface of the housing. The housing is made of heat conducting material having a metal and a crystalline carbon. An independent claim is also included for a method for manufacturing a heat sink for a chip.

机译：散热器具有基板，该基板的上表面与芯片的下表面连接。壳体（15）具有上表面和下表面，其中下表面在四个侧面上邻接。侧面邻接在底面上。在芯片的上表面和壳体的下表面之间设置有热接触层。壳体由具有金属和结晶碳的导热材料制成。还包括一种用于制造芯片的散热器的方法的独立权利要求。

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公开/公告号DE102006006538A1

专利类型
公开/公告日2006-08-31

原文格式PDF
申请/专利权人 MITAC TECHNOLOGY CORP.;
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申请/专利号DE20061006538
发明设计人 HWANG MING-HANG;CHENG YU-CHIANG;CHEN CHAO-YI;LEE PING-FENG;KUO HSIN-LUNG;LEE BIN-WEI;HSIAO WEI-CHUNG;
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申请日2006-02-10
分类号H01L23/36;H01L23/055;F28F21;G06F1/20;H05K7/20;
国家 DE
入库时间 2022-08-21 21:20:09

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