首页> 外国专利> Cooling system for electronic microchips has a heat sink, a heat exchanger and a pump to circulate a liquid between the heat sink and the heat exchanger via connection tubes

Cooling system for electronic microchips has a heat sink, a heat exchanger and a pump to circulate a liquid between the heat sink and the heat exchanger via connection tubes

机译：用于电子微芯片的冷却系统具有散热器，热交换器和泵，以通过连接管在散热器和热交换器之间循环液体

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摘要

Made from heat-conducting material containing metal and a crystalline carbon, a heat sink (33) can absorb a microchip's operating heat. A heat exchanger (34) serves to draw heat off. Two or more connection tubes (351) interlink the heat sink with the heat exchanger. A pump (35) brings a liquid via the tubes in a circuit between the heat sink and the heat exchanger. An independent claim is also included for a method for producing a heat sink.

机译：散热器（33）由包含金属和结晶碳的导热材料制成，可以吸收微芯片的工作热量。热交换器（34）用于排出热量。两个或多个连接管（351）将散热器与热交换器互连。泵（35）通过管子将液体带入散热器和热交换器之间的回路中。还包括用于制造散热器的方法的独立权利要求。

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公开/公告号DE102006004636A1

专利类型
公开/公告日2006-09-07

原文格式PDF
申请/专利权人 MITAC TECHNOLOGY CORP.;
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申请/专利号DE20061004636
发明设计人 HWANG MING-HANG;CHENG YU-CHIANG;LEE BIN-WEI;HSIAO WEI-CHUNG;LEE PING-FENG;CHEN CHAO-YI;KUO HSIN-LUNG;
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申请日2006-01-31
分类号F28F21/00;H01L23/473;H05K7/20;G06F1/20;
国家 DE
入库时间 2022-08-21 21:20:07

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