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Printed circuit board for e.g. mobile phone, has conductive via holes connecting coil conductor patterns such that patterns and holes form spiral conductor, and lead out patterns connected to inner and outer ends of conductor
Printed circuit board for e.g. mobile phone, has conductive via holes connecting coil conductor patterns such that patterns and holes form spiral conductor, and lead out patterns connected to inner and outer ends of conductor
The board has coil conductor patterns (1100a-1100d) provided on conductor layers such that the patterns are parallel to each other. Conductive via holes connect the patterns such that the patterns and the holes form a spiral conductor all together. The patterns are longer than an adjacent inner coil conductor pattern of the conductor. Lead out patterns (1103a, 1103b) are connected to inner and outer ends of the conductor. An independent claim is also included for a method of fabricating a printed circuit board.
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