首页> 外国专利> Method for fastening substrate at substrate holder involves laying of first side of substrate on substrate holder, setting of first fluid pressure at first sub range of first side of substrate and setting of second fluid pressure

Method for fastening substrate at substrate holder involves laying of first side of substrate on substrate holder, setting of first fluid pressure at first sub range of first side of substrate and setting of second fluid pressure

机译：将基板固定在基板支架上的方法包括在基板支架上放置基板的第一面，在基板的第一面的第一子范围处设定第一流体压力以及设定第二流体压力

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摘要

The method involves laying of first side of substrate on substrate holder (10), setting of first fluid pressure at the first sub range (26,28,30) of first side of substrate and setting of second fluid pressure at the second sub range of the first side of the substrate. The setting of first fluid pressure and second fluid pressure are implemented after one another. An independent claim is also included for the substrate holding device.

机译：该方法包括将基板的第一侧放置在基板支架（10）上，将第一流体压力设置在基板第一侧的第一子范围（26、28、30）上，并且将第二流体压力设置在第二基板的第二子范围上。基板的第一面。依次进行第一流体压力和第二流体压力的设定。基板保持装置也包括独立权利要求。

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公开/公告号DE102004061054A1

专利类型
公开/公告日2006-07-06

原文格式PDF
申请/专利权人 INFINEON TECHNOLOGIES AG;
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申请/专利号DE20041061054
发明设计人 BRUCH JENS;STAECKER JENS;HOMMEN HEIKO;SCHUMACHER KARL;SCHIWON ROBERTO;SCHMIDT-LANZ MARTIN;EFFERENN DIRK;
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申请日2004-12-18
分类号H01L21/68;G03F7;
国家 DE
入库时间 2022-08-21 21:20:33

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