首页> 外国专利> PLANAR LIGHT ILLUMINATION AND IMAGING (PLIIM) BASED SYSTEM HAVING A LINEAR IMAGE DETECTION CHIP MOUNTING ASSEMBLY WITH MEANS FOR PREVENTING MISALIGNMENT BETWEEN THE FIELD OF VIEW (FOV) OF SAID LINEAR IMAGE DETECTION CHIP AND THE CO-PLANAR LASER ILLUMINATION BEAM (PLIB) PRODUCED BY SAID PLIIM BASED SYSTEM, IN RESPONSE TO THERMAL EXPANSION AND/OR CONTRACTION WITHIN SAID PLIIM BASED SYSTEM

PLANAR LIGHT ILLUMINATION AND IMAGING (PLIIM) BASED SYSTEM HAVING A LINEAR IMAGE DETECTION CHIP MOUNTING ASSEMBLY WITH MEANS FOR PREVENTING MISALIGNMENT BETWEEN THE FIELD OF VIEW (FOV) OF SAID LINEAR IMAGE DETECTION CHIP AND THE CO-PLANAR LASER ILLUMINATION BEAM (PLIB) PRODUCED BY SAID PLIIM BASED SYSTEM, IN RESPONSE TO THERMAL EXPANSION AND/OR CONTRACTION WITHIN SAID PLIIM BASED SYSTEM

机译：基于平面光照明和成像（PLIIM）的系统，该系统具有组装的线性图像检测芯片，并采用了防止线性图像检测芯片和共平面激光辐照光束（PLB）的视场（FOV）误解的装置。基于SAID PLIIM的系统，以响应基于SAID PLIIM的系统中的热膨胀和/或压缩

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摘要

A planar laser illumination and imaging (PLIIM) based system comprising a linear image formation and detection module having (i) an image sensing chip having a plurality of conductive pins establishing electrical interconnections with conductive elements within a chip mounting socket mounted on an electronic camera board, and (ii) image forming optics with a field of view. The system also includes a heat-exchanging structure, rigidly connected to the image formation optics, and having (i) a body portion provided with heat exchanging elements, (ii) a plurality of apertures through which the plurality of conductive pins on the image sensing chip pass to establish electrical interconnections with the conductive elements within the chip mounting socket, and (III) a plurality of mechanical elements for releasably engaging the package of the image sensing chip so as to rigidly maintain the image sensing chip in alignment with the image forming optics.

机译：一种基于平面激光照明和成像（PLIIM）的系统，包括线性成像和检测模块，该模块具有（i）图像传感芯片，该图像传感芯片具有多个导电针，这些导电针与安装在电子相机板上的芯片安装插座内的导电元件建立了电气互连（ii）具有视场的成像光学元件。该系统还包括热交换结构，该结构牢固地连接到成像光学器件，并且具有（i）设有热交换元件的主体部分，（ii）多个孔，图像感测上的多个导电针穿过该孔芯片通过以与芯片安装插座内的导电元件建立电互连，以及（III）多个机械元件，用于可释放地接合图像感测芯片的封装，从而使图像感测芯片牢固地保持与成像对准光学。

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公开/公告号US6978935B2

专利类型
公开/公告日2005-12-27

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申请/专利权人 CONSTANTINE J. TSIKOS;C. HARRY KNOWLES;XIAOXUN ZHU;MICHAEL D. SCHNEE;KA MAN AU;ALLAN WIRTH;TIMOTHY A. GOOD;ANDREW JANKEVICS;SANKAR GHOSH;CHARLES A. NAYLOR;THOMAS AMUNDSEN;ROBERT BLAKE;WILLIAM SVEDAS;SHAWN DEFONEY;EDWARD SKYPALA;PIROOZ VATAN;RUSSELL JOSEPH DOBBS;GEORGE KOLIS;MARK S. SCHMIDT;JEFFERY YORSZ;PATRICK A. GIORDANO;STEPHEN J. COLAVITO;DAVID W. WILZ SR.;BARRY E. SCHWARTZ;STEVEN Y. KIM;DALE FISHER;JON VAN TASSELL;
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申请/专利号US20020131573
发明设计人 MICHAEL D. SCHNEE;CONSTANTINE J. TSIKOS;ALLAN WIRTH;STEPHEN J. COLAVITO;MARK S. SCHMIDT;TIMOTHY A. GOOD;XIAOXUN ZHU;ROBERT BLAKE;C. HARRY KNOWLES;THOMAS AMUNDSEN;JEFFERY YORSZ;SANKAR GHOSH;ANDREW JANKEVICS;WILLIAM SVEDAS;DALE FISHER;JON VAN TASSELL;SHAWN DEFONEY;STEVEN Y. KIM;EDWARD SKYPALA;PATRICK A. GIORDANO;CHARLES A. NAYLOR;GEORGE KOLIS;BARRY E. SCHWARTZ;PIROOZ VATAN;RUSSELL JOSEPH DOBBS;KA MAN AU;DAVID W. WILZ SR.;
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申请日2002-04-23
分类号G06K7/10;
国家 US
入库时间 2022-08-21 21:40:55

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