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Method of connecting internal silver traces to external gold to produce a gold external side metal for an LTCC package

机译:将内部银迹线连接到外部金以生产用于LTCC封装的金外部金属的方法

摘要

A method of connecting internal silver traces to external gold to produce a gold external side metal for a low-temperature co-fired ceramic package includes the deposition of a ruthenium dioxide cermet barrier layer between layers of gold and silver. An LTCC package constructed in accord with the inventive method has gold, ruthenium and silver layers that are parallel to the LTCC package surface and normal to and also electrically coupled to a conductive trace formed within the LTCC layers of the package.
机译:将内部银迹线连接到外部金以产生用于低温共烧陶瓷封装的金外部金属的方法包括在金和银层之间沉积二氧化钌金属陶瓷阻挡层。根据本发明的方法构造的LTCC封装具有与LTCC封装表面平行并且与形成在封装的LTCC层内的导电迹线垂直并且还电耦合至该导电迹线的金,钌和银层。

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