首页> 外国专利> The AlTi alloy or the AlTiB alloy where the Ti grain diameter which

The AlTi alloy or the AlTiB alloy where the Ti grain diameter which

机译:AlTi合金或AlTiB合金的Ti晶粒直径

摘要

PROBLEM TO BE SOLVED: To provide an aluminum substrate for lithographic plate, in which the occurrence of striped fault caused by the existence of Ti grains added to aluminum or aluminum alloy for the purpose of grain refining is prevented, and its production. ;SOLUTION: This aluminum substrate for lithographic plate is obtained by casting Ti-containing aluminum, applying cold rolling and/or heat treatment, and subjecting the resultant sheet to straightening and to surface roughening. At this time, the width of Ti grains existing in the surface layer of the aluminum sheet, ranging from the surface to a position at a depth of 20μm from the surface, and lenticularly elongated along the rolling direction, is regulated to ≤100μm. An Al-Ti or Al-Ti-B alloy composed of grains and having 1.0mm Ti grain size is added to molten aluminum and this molten aluminum alloy is directly cast and rolled continuously into cast plate of ≤10mm thickness by means of a couple of cooling rolls. Subsequently, either or both of cold rolling and heat treatment are applied to this cast plate to form an aluminum alloy sheet of 0.1-0.5mm thickness. Then, straightening and surface roughing are performed. By this method, the aluminum substrate for lithographic plate can be produced.;COPYRIGHT: (C)1997,JPO
机译:解决的问题:提供一种用于平版印刷版印刷版的铝基板,其中防止了由于添加到铝或铝合金中以晶粒细化为目的的Ti晶粒的存在而引起的条纹缺陷的发生及其生产。 ;解决方案:这种平版印刷铝基板是通过铸造含Ti的铝,进行冷轧和/或热处理,然后对所得的片材进行矫直和表面粗糙处理而获得的。此时,将存在于铝板的表层的Ti晶粒的宽度从表面到距表面的深度为20μm的位置,沿着轧制方向呈双凸状地拉伸,以使其为≥1mm。 100微米将由晶粒组成且Ti晶粒尺寸小于1.0mm的Al-Ti或Al-Ti-B合金添加到熔融铝中,然后通过铸造将其直接铸造并连续轧制成厚度小于10mm的铸板几个冷却辊。随后,对该铸板进行冷轧和热处理中的一者或两者,以形成厚度为0.1-0.5mm的铝合金板。然后,进行矫直和表面粗化。通过这种方法,可以生产出用于平版印刷版的铝基板。;版权所有:(C)1997,日本特许厅

著录项

  • 公开/公告号JP3781211B2

    专利类型

  • 公开/公告日2006-05-31

    原文格式PDF

  • 申请/专利权人 富士写真フイルム株式会社;

    申请/专利号JP19960127712

  • 发明设计人 曽根 亘;榊 博和;澤田 宏和;

    申请日1996-04-25

  • 分类号C22C21/00;B22D11/00;B22D11/06;B22D11/12;B22D27/20;B41N1/08;C22F1/04;

  • 国家 JP

  • 入库时间 2022-08-21 21:49:48

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号