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Substrate layer mechanical characteristic e.g. elastic constant, finding method for e.g. electronic circuit production, involves finding mechanical characteristic from substrate deformation parameter measured on thin sheet
Substrate layer mechanical characteristic e.g. elastic constant, finding method for e.g. electronic circuit production, involves finding mechanical characteristic from substrate deformation parameter measured on thin sheet
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机译：基材层的机械特性弹性常数，例如电子电路生产，涉及从薄板上测量的基板变形参数中找出机械特性
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摘要
The method involves removing a thin sheet from a surface of a substrate (A) of a transistor, and measuring a deformation parameter of the substrate on the sheet. The two steps are repeated on another sheet having a different thickness. Mechanical characteristics e.g. elastic constant and dilation coefficient of semiconductor materials, of a part (B), are determined from the deformation parameters, using a modeling technique.
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