首页> 外国专利> Device for cutting off helical spring with narrow windings at ends from wire after production, comprising laser beam guided in slightly obtuse angle

Device for cutting off helical spring with narrow windings at ends from wire after production, comprising laser beam guided in slightly obtuse angle

机译:用于在生产后从金属丝的端部切掉螺旋形弹簧的装置,该螺旋弹簧的末端具有较窄的绕组,该装置包括以稍微钝角引导的激光束

摘要

The device (1) comprises an optical unit (2) for focussing the laser beam (5) and a return unit (3). The return unit (3), working with a mirror, causes the beam (5) which has already been partly focussed by a lens (4) to exit the device (1) in a slightly obtuse angle (13). The end (10) of a helical spring (8) wound in order to keep the windings at a minimal distance or in an overlapping position can be cut off the wire it is made from without cutting through more windings than the one (10) intended to be cut.
机译:装置(1)包括用于聚焦激光束(5)的光学单元(2)和返回单元(3)。返回单元(3)与镜子一起工作,使已经被透镜(4)部分聚焦的光束(5)以稍微钝角(13)离开设备(1)。可以将螺旋弹簧(8)的末端(10)缠绕以将绕组保持在最小距离或处于重叠位置,可以将其切下的导线切断,而不会切穿比预期的绕组(10)更多的绕组被削减。

著录项

  • 公开/公告号DE202004018626U1

    专利类型

  • 公开/公告日2005-02-10

    原文格式PDF

  • 申请/专利权人 TRUMPF WERKZEUGMASCHINEN GMBH + CO. KG;

    申请/专利号DE20042018626U

  • 发明设计人

    申请日2004-12-02

  • 分类号B23K26/02;

  • 国家 DE

  • 入库时间 2022-08-21 22:00:24

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