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Punched grid arrangement for automobile, has printed circuit board with conductor unit having rest medium and widened conductor path for dissipation of heat from electrical and/or electronic units
Punched grid arrangement for automobile, has printed circuit board with conductor unit having rest medium and widened conductor path for dissipation of heat from electrical and/or electronic units
The arrangement has a printed circuit board (PCB) (2) connected with a punched grid area and including a conductor unit (3a) with a rest medium (3b). The PCB has electrical and/or electronic units and a widened conductor path for dissipation of heat from the electrical and/or electronic units, where path has a width of about 5 millimeters. The electrical and electronic units are arranged in a solder path for soldering.
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