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Method for drilling microholes with a laser beam

机译：用激光束钻孔的方法

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摘要

To drill micro-holes in a multi-layer substrate having a first metal layer and at least one second metal layer, and having a dielectric layer arranged between two metal layers, use is made of a solid-state laser. The beam of the laser, in a first operation, ablates the first metal layer and, in a second operation, ablates the dielectric layer down to the second metal layer. In the first operation, the laser beam is set to a repetition frequency of at least 15 kHz, focused onto the first metal layer and moved in a circle corresponding to the diameter of the desired hole, in such a number of passes until this metal layer is cut through. Then, in the second operation, the laser beam is set to a preferably lower repetition frequency, directed out of focus onto the dielectric layer exposed in the hole and moved, with a circumferential velocity which is higher compared with the first operation, in one or more concentric circles, until the dielectric layer is ablated in the hole region. The effective energy density in the second operation is selected, by setting the defocusing and the circumferential velocity, in such a way that the effective energy density lies below the threshold for ablation of the second metal layer.
机译：为了在具有第一金属层和至少一个第二金属层并且具有布置在两个金属层之间的介电层的多层基板上钻微孔，使用了固态激光器。在第一操作中，激光束烧蚀第一金属层，并且在第二操作中，烧蚀介电层直至第二金属层。在第一个操作中，将激光束设置为至少15 kHz的重复频率，聚焦到第一金属层上，并以与所需孔的直径相对应的圆移动，经过多次，直到该金属层被切断。然后，在第二操作中，将激光束设置为优选较低的重复频率，在一个或一个以上的激光束中，其焦点偏离聚焦到暴露在孔中的介电层上并以比第一操作更高的圆周速度移动。更多同心圆，直到在孔区域中烧蚀介电层。通过设置散焦和圆周速度来选择第二操作中的有效能量密度，使得有效能量密度低于第二金属层的烧蚀阈值。

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