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A sample preparation device for failure analysis in semiconductor wafer and its preparation method
A sample preparation device for failure analysis in semiconductor wafer and its preparation method
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机译:用于半导体晶片中失效分析的样品制备装置及其制备方法
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摘要
PURPOSE: An apparatus and a method for manufacturing a sample are provided to analyzing exactly a wafer, to economize fabrication time and to recycle the sample for another analysis by exposing selectively a cross-section of the sample instead of cutting completely the sample using a polishing rod. CONSTITUTION: An apparatus for manufacturing a sample includes a wafer(1), a fixing part, a rotary polishing rod and a controller. The fixing part(6) fixes the wafer. The polishing rod(4) is capable of moving freely to a desired position. The polishing rod includes a polishing part(5). The controller is used for controlling the motion of the polishing rod.
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