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PATTERN INSPECTION METHOD USING MONITORING-PATTERN MODULE FOR DETECTING PATTERN UNIFORMITY WITHOUT MEASURING DIRECTLY PATTERN SIZE AND LINE WIDTH
PATTERN INSPECTION METHOD USING MONITORING-PATTERN MODULE FOR DETECTING PATTERN UNIFORMITY WITHOUT MEASURING DIRECTLY PATTERN SIZE AND LINE WIDTH
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机译：使用监测模式模块检测模式均匀性的模式检查方法，无需直接测量模式尺寸和线宽
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摘要
Purpose: it is arranged to the multistage state and a bridge state of detection one in the gap between monitoring pattern by being inserted into multiple monitoring pattern modules in a lithography process using one mode observation of monitoring-pattern module. Construction: multiple monitoring pattern modules comprising multiple monitoring patterns are imprinted on multiple positions on a surface of a chip by executing a lithography process (120). One gap inspection process will be checked the gap between monitoring pattern within monitoring pattern module (130). By using a gap state (such as multistage a state and a bridge state (140)), the pattern uniformity detection of chip.
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