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Polymer solder hybrid interface material with improved solder filler particle size and microelectronic package application
Polymer solder hybrid interface material with improved solder filler particle size and microelectronic package application
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机译：具有改善的焊料填充物粒度和微电子封装应用的聚合物焊料混合界面材料
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摘要
One embodiment of the invention includes a thermal interface material. The thermal interface material includes a polymer matrix; a plurality of fusible particles dispersed within the polymer matrix; and a plurality of non-fusible particles dispersed within the polymer matrix. The fusible particles have a mean particle size that is greater than the maximum particle size of the non-fusible particles. The thermal interface material improves performance of an integrated circuit.
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