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Mechanical load test method for semiconductor devices
Mechanical load test method for semiconductor devices
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机译：半导体装置的机械负荷试验方法
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摘要
PROBLEM TO BE SOLVED: To enable a test including a three-dimensional deformation effect in a fatigue test of a soldered part by developing bending in the plural directions by a mechanical load on a semiconductor device used as a test piece. SOLUTION: A semiconductor device 3 used as a test piece has an electronic device composed by surface mounting of a semiconductor package 1 having a structure jointed with a chip 4 through solder bumps 6, on the center part on a square circuit board 2 (or a mother board). The semiconductor device 3 is four-point supported on a support stand 8 by support parts 9, and a concentrated load is loaded on the center part thereof by a load application mechanism part 10. Hereby, three-dimensional deformation is developed on the semiconductor device 3 and it becomes more similar to a deformation mode in a thermal load. A relation chart between the load detected by a load cell 11 and a changed quantity detected by a displacement meter 13 is acquired. In this case, if the repeated deformation is given, an electric resistance is measured simultaneously by a junction electric resistance measuring apparatus 15, to thereby confirm electric conductivity at the junction.
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