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Approaching to the semiconductor device of the cooling wheel and its production manner and the semiconductor
Approaching to the semiconductor device of the cooling wheel and its production manner and the semiconductor
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机译:冷却轮的半导体器件及其生产方式和半导体的探讨
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摘要
PROBLEM TO BE SOLVED: To provide a heat sink on which a heat-resistive mark can be easily and efficiently made and that hardly causes the height variation.;SOLUTION: The heat sink 2 for dissipating heat generated in a semiconductor element 5 is disposed near the semiconductor element 5 in a semiconductor package 1. It has a mark 9 formed at a specified portion of a copper or copper alloy metal plate 10 by a black oxidation process as an index for mounting the semiconductor package 1 on a substrate.;COPYRIGHT: (C)2002,JPO
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