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ANALYZING PROGRAM OF INSPECTION DATA, INSPECTION UNIT, REVIEW UNIT, AND YIELD ANALYZING UNIT

机译：检验数据，检验单位，审查单位和产量分析单位的分析程序

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摘要

PPROBLEM TO BE SOLVED: To provide a method of easily determining how a manufacturing device used for manufacturing products, such as semiconductor integrated circuits, thin film magnetic heads, optical devices, etc, affects defective products. PSOLUTION: An inspection data analyzing program is composed of programs for carrying out processing of invoking a first inspection data in a main storage device as the result of execution of device QC for a specific manufacturing device; invoking a variation in the numbers of defectives in the main storage device corresponding to the number of contaminants calculated for each defect size, on the basis of second inspection data as the result of execution of device QC for the manufacturing device and the electric test data of the products processed through the manufacturing device during a term including a point of time at which a second inspection is carried out; and obtaining the degree of influence of contaminants which are produced in the manufacturing device to have an effect on the products at a time of point, at which the first inspection data are detected by the use of a variation in the number of defectives corresponding to the calculated number of contaminants and the number of contaminants obtained from the first inspection data for each defect size. These programs can be executed through an arithmetic unit. PCOPYRIGHT: (C)2005,JPO&NCIPI

机译：

要解决的问题：提供一种容易地确定用于制造产品的制造设备（例如半导体集成电路，薄膜磁头，光学设备等）如何影响次品的方法。解决方案：检查数据分析程序由用于执行特定制造设备的设备QC的结果的，用于执行在主存储设备中调用第一检查数据的处理的程序组成;基于作为制造装置的装置QC的执行结果的第二检查数据和制造装置的电测试数据，基于与每个缺陷尺寸计算出的污染物数量相对应的主存储装置中的缺陷数量变化。在包括进行第二次检查的时间点的期限内通过制造设备加工的产品;并且获得在制造设备上产生的污染物对产品产生影响的程度的影响程度，在该时刻，通过使用对应于缺陷的缺陷数量的变化来检测第一检验数据。计算出的污染物数量，以及从每种缺陷尺寸的第一检验数据获得的污染物数量。这些程序可以通过算术单元执行。

版权：（C）2005，JPO＆NCIPI 展开▼

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公开/公告号JP2005044840A

专利类型
公开/公告日2005-02-17

原文格式PDF
申请/专利权人 HITACHI HIGH-TECHNOLOGIES CORP;
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申请/专利号JP20030200189
发明设计人 ONO MAKOTO;ASAKAWA YOHEI;
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申请日2003-07-23
分类号H01L21/02;H01L21/66;
国家 JP
入库时间 2022-08-21 22:32:37

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