首页> 外国专利> MANUFACTURING METHOD FOR SEMICONDUCTOR THIN-FILM, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THIN-FILM TRANSISTOR, THIN-FILM TRANSISTOR AND LIQUID-CRYSTAL DISPLAY AND MANUFACTURING METHOD FOR DRIVER-CIRCUIT INTEGRAL TYPE LIQUID-CRYSTAL DISPLAY

MANUFACTURING METHOD FOR SEMICONDUCTOR THIN-FILM, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THIN-FILM TRANSISTOR, THIN-FILM TRANSISTOR AND LIQUID-CRYSTAL DISPLAY AND MANUFACTURING METHOD FOR DRIVER-CIRCUIT INTEGRAL TYPE LIQUID-CRYSTAL DISPLAY

机译:半导体薄膜的制造方法,薄膜晶体管的半导体装置及制造方法,薄膜晶体管及液晶显示器的制造方法,驱动电路一体型液晶显示器的制造方法

摘要

PROBLEM TO BE SOLVED: To obtain a silicon thin-film being composed of a crystal having a large grain size corresponding to a device size and having the small irregularities of the surface of the crystal.;SOLUTION: An amorphous silicon thin-film 12a is deposited on an insulating layer 11 formed on a substrate 10. A first laser annealing is carried out to the amorphous silicon thin-film 12a, and a polysilicon thin-film 12b having a crystal-grain size of 0.2 m or more is formed. A second laser annealing is carried out to the polysilicon thin-film 12b, crystal grains are grown in the parallel direction to the surface of the substrate 10 and the polysilicon thin-film 12c having a size of 4 m or more in the growth direction of the crystal grains is formed.;COPYRIGHT: (C)2005,JPO&NCIPI
机译:解决的问题:要获得由具有与器件尺寸相对应的大晶粒尺寸且具有小的晶体表面不规则性的晶体的硅薄膜;解决方案:非晶硅薄膜12a是沉积在形成于基板10上的绝缘层11上的多晶硅膜上。对非晶硅薄膜12a进行第一激光退火,并且形成具有0.2m以上的晶粒尺寸的多晶硅薄膜12b。对多晶硅薄膜12b进行第二次激光退火,在与基板10和多晶硅薄膜12c的表面平行的方向上生长具有4m以上尺寸的晶粒。版权所有:(C)2005,日本特许厅&日本全国协力机构

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