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Workpiece or component heating method for formation of solder connection using convection heating via heated gas flow
Workpiece or component heating method for formation of solder connection using convection heating via heated gas flow
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机译：工件或组件加热方法，用于通过对流加热通过加热气流形成焊料连接
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摘要
The heating method uses convection heating phases, in which a heated gas flow (34) is provided by feeding a gas flow (23) through a gas pervious heating body (13) and directed onto at least one surface region of the workpiece (26) or component, for heating an applied solder material to form a solder connection. An Independent claim for a device for heating a workpiece or component for forming a solder connection is also included.
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