首页> 外国专利> Testing brittle fracture behavior of chip cards involves subjecting cards to step flexural load so that bending takes place in range of 150 to 180 degrees about their longitudinal or transverse axes

Testing brittle fracture behavior of chip cards involves subjecting cards to step flexural load so that bending takes place in range of 150 to 180 degrees about their longitudinal or transverse axes

机译:测试芯片卡的脆性断裂行为包括使卡承受阶跃弯曲载荷,以使弯曲围绕其纵向或横向轴在150至180度的范围内进行

摘要

The method involves subjecting the chip cards (7) to a step flexural load so that bending takes place in a range of 150 to 180 degrees. The chip cards can be bent about their longitudinal axes or about their transverse axes. The step flexural load is applied in a time window of 200 to 1000 ms. The cards are pre-stressed by an element (8) arranged centrally under the card under test. AN Independent claim is also included for the following: (a) a test machine for testing brittle fracture behavior of chip cards.
机译:该方法包括使芯片卡(7)经受阶跃弯曲载荷,使得弯曲在150度至180度的范围内发生。芯片卡可以绕其纵轴或横轴弯曲。阶跃弯曲载荷在200到1000 ms的时间窗口内施加。卡片由位于被测卡片下方中央的元件(8)施加预应力。还包括以下方面的独立权利要求:(a)用于测试芯片卡的脆性断裂行为的测试机。

著录项

  • 公开/公告号DE10222211A1

    专利类型

  • 公开/公告日2003-11-27

    原文格式PDF

  • 申请/专利权人 ORGA KARTENSYSTEME GMBH;

    申请/专利号DE2002122211

  • 发明设计人 JANCZEK THIES;

    申请日2002-05-16

  • 分类号G01M19/00;G01M5/00;G01M7/08;G01N3/30;

  • 国家 DE

  • 入库时间 2022-08-21 22:44:17

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