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Method of Production of Composited Particle, Composited Particle Produced by This Method and Aqueous Dispersion for Chemical Mechanical Polishing Containing This Composited Particle, and Method of Production of Aqueous Dispersion for Chemical Mechanical Polishing
Method of Production of Composited Particle, Composited Particle Produced by This Method and Aqueous Dispersion for Chemical Mechanical Polishing Containing This Composited Particle, and Method of Production of Aqueous Dispersion for Chemical Mechanical Polishing
An object of the present invention is to provide a method for producing a composited particle in which an inorganic particle is not released, a composited particle produced by this method, and an aqueous dispersion for CMP containing this composited particle. The method for producing a composited particle of the present invention comprises forming a preliminary particle by adhering one or more types of inorganic particles on at least a part of the surface area of a polymer particle, then, polycondensing at least one selected from among organosilicon compounds and organometal compounds in the presence of the above-mentioned preliminary particle. Another object of the present invention is to provide a method for producing an aqueous dispersion for CMP in which generation of a coagulates in production is prevented. In the method for producing an aqueous dispersion for CMP of the present invention, the pH of an aqueous dispersion containing polymer particles and inorganic particles having a zeta potential of the same sign as that of said polymer particles is so changed that the zeta potential of said polymer particles and the zeta potential of said inorganic particles are of opposite signs, to form composite particles composed of the said polymer particles and the said inorganic particles.
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