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Method of designing a multi-module single-chip circuit system

机译:设计多模块单片机电路系统的方法

摘要

A method of designing a single-chip circuit system that includes several dissimilar (digital, analog, memory, power, RF, electro-optical) modules, and the system so designed. A prior art method is used for an initial design of the system, including signal and power conductors connecting the modules. Signal conductors are initially designed for current densities in a first range. Power conductors are initially designed for current densities in a second range. For each signal conductor, an initial value of a design parameter is changed to increase the current density into a higher third range, the resistance of the conductor is reduced, and the parameter value is restored to its initial value. For each power conductor, an initial value of a design parameter is changed to decrease the current density into a lower fourth range, the resistance of the conductor is increased, and the parameter value is restored to its initial value.
机译:一种设计包括多个不同(数字,模拟,存储器,电源,RF,电光)模块的单芯片电路系统的方法,以及所设计的系统。现有技术方法用于系统的初始设计,包括连接模块的信号导体和功率导体。信号导体最初设计用于第一范围内的电流密度。功率导体最初设计用于第二范围内的电流密度。对于每个信号导体,更改设计参数的初始值,以将电流密度增加到更高的第三范围,减小导体的电阻,并将参数值恢复为其初始值。对于每个电力导体,更改设计参数的初始值以将电流密度减小到较低的第四范围,增加导体的电阻,并将参数值恢复为其初始值。

著录项

  • 公开/公告号US6694494B2

    专利类型

  • 公开/公告日2004-02-17

    原文格式PDF

  • 申请/专利权人 DARO SEMICONDUCTORS LTD.;

    申请/专利号US20020096898

  • 发明设计人 ERAN WEIS;

    申请日2002-03-14

  • 分类号G06F175/00;

  • 国家 US

  • 入库时间 2022-08-21 23:14:03

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