Wafer for evaluating machinability of periphery of wafer and method for evaluating machinability of periphery of wafer

• 1. 用于切削材料的晶片制造和晶片处理的方法 [P] . 中国专利： CN107454892B . 2021.08.31
• 2. 用于切削材料的晶片制造和晶片处理的方法 [P] . 中国专利： CN107454892A . 2017-12-08
• 3. WAFER FOR EVALUATING MACHINABILITY OF PERIPHERY OF WAFER AND METHOD FOR EVALUATING MACHINABILITY OF PERIPHERY OF WAFER [P] . 韩国专利： KR100750607B1 . 2007-08-20

  机译： 评估晶圆周边的可加工性的晶圆和评估晶圆周边的可加工性的方法

• 4. Wafer for evaluating machinability of periphery of wafer and method for evaluating machinability of periphery of wafer [P] . 美国专利： US2002179244A1 . 2002-12-05

  机译： 用于评估晶片外围的可切削性的晶片以及用于评估晶片外围的可切削性的方法

• 5. WAFER FOR EVALUATING MACHINABILITY OF PERIPHERY OF WAFER AND METHOD FOR EVALUATING MACHINABILITY OF PERIPHERY OF WAFER [P] . 欧洲知识产权局专利： EP1178525A1 . 2002-02-06

  机译： 评估晶圆周边的可加工性的晶圆和评估晶圆周边的可加工性的方法

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• 6. Surface Modification Using Assisting Electrodes in Wire Electrical Discharge Machining for Silicon Wafer Preparation [O] . Chunliang Kuo, Yupang Nien, Anchun Chiang, 2021
• 7. Influence of Wafer Edge Profile on STI-CMP Process Performance : Examination Based on Surface Pressure of Wafer Calculated by FEM Analysis(Machine Elements, Design and Manufacturing) [O] . Akira FUKUDA, Tetsuo FUKUDA, Hirokuni HIYAMA, 2010

• 1. Fine Machining of Large-Diameter 6H-SiC Wafers [J] . Xiufang CHEN Juan LI Deying MA Xiaobo HU Xiangang XU Minhua JIANG . 材料科学技术：英文版 . 2006,第5期
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