Solder ball disposing apparatus, solder ball reflow apparatus, and solder ball bonding apparatus

• 1. 植球装置、焊球拾取方法以及焊球安装方法 [P] . 中国专利： CN102610535B . 2014.07.09
• 2. 植球装置、焊球拾取方法以及焊球安装方法 [P] . 中国专利： CN102610535A . 2012-07-25
• 3. Solder ball disposing apparatus, solder ball reflow apparatus, and solder ball bonding apparatus [P] . 美国专利： US2002113115A1 . 2002-08-22

  机译： 焊球配置装置，焊球回流装置以及焊球接合装置

• 4. Ball capturing apparatus, solder ball disposing apparatus, ball capturing method, and solder ball disposing method [P] . 美国专利： US7717317B2 . 2010-05-18

  机译： 焊球捕捉装置，焊锡球配置装置，焊球捕捉方法以及焊锡球配置方法

• 5. BALL CAPTURING APPARATUS, SOLDER BALL DISPOSING APPARATUS, BALL CAPTURING METHOD, AND SOLDER BALL DISPOSING METHOD [P] . 美国专利： US2008020561A1 . 2008-01-24

  机译： 球捕捉装置，焊料球放置装置，球捕捉方法和焊料球放置方法

• 1. Capillary wave formation on excited solder jet and fabrication of lead-free solder ball [J] . ZHANG Shu-guang, HE Li-jun, ZHU Xue-xin, 中国有色金属学报（英文版） . 2005,第005期
• 2. Essential factors influencing the wettability of Sn-3.0Ag-0.5Cu solder balls on Au pad of the right-angle solder interconnect in laser jet solder ball bonding [C] . Wu Yue, Xin-Ping Zhang International Conference on Electronic Packaging Technology . 2015
• 3. Investigation and analysis on the solder ball shear strength of plastic ball grid array, chip scale, and flip chip packages with eutectic lead-tin and lead-free solders. [D] . Huang, Xingjia. 2003
• 4. Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography [O] . Xiuyun Zhou, Jinlong Zhou, Guiyun Tian, 2015
• 5. Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid array packages [O] . M. D. Cheng, S. Y. Chang, S. F. Yen, 2004

• 1. FORMATION AND CHANGE OF AuSn_4 COMPOUNDS AT INTERFACE BETWEEN PBGA SOLDER BALL AND Au/Ni/Cu METALLIZATION DURING LASER AND INFRA-RED REFLOW SOLDERING [J] . Y.H.Tian ,C.Q.Wang State Key Laboratory of Advanced Welding Production TechnologyHarbin Institute of TechnologyHarbin 150001China . 金属学报：英文版 . 2004,第2期
• 2. Study on laser and hot air reflow soldering of PBGA solder ball [J] . 田艳红 ,王春青 . 中国焊接 . 2002,第002期
• 3. Characteristics of Laser Reflow Bumping of Sn3.5Ag and Sn3.5Ag0.5Cu Lead-Free Solder Balls [J] . Yanhong TIAN Chunqing WANG Yarong CHEN . 材料科学技术：英文版 . 2008,第2期
• 4. NUMERICAL SIMULATION OF THE TEMPERATURE FIELD IN A SOLDER BALL UNDER PULSED LASER AND ITS EFFECT ON THE VIBRATION OF THE SOLDER [J] . C. Q. Wang ,M. Y. Li and L. Fang (National Key Laboratory of Advanced Welding Production Technology H. I. T. Harbin 150001 China) . 金属学报：英文版 . 2000,第1期
• 5. 焊球的形成机理及去除方式研究 [C] . Li Huawei ,李华伟 ,Shen Xiaogang . 2019中国高端SMT学术会议 . 2019
• 6. 回流焊工艺中焊点形状及固化焊球残余应力的研究 [A] . 李宾 . 2012