首页>
外国专利>
Real-time polishing pad stiffness control using magnetically controllable fluid
Real-time polishing pad stiffness control using magnetically controllable fluid
展开▼
机译：使用可磁控流体实时抛光垫刚度控制
展开▼
页面导航
摘要
著录项
相似文献
摘要
A method of CMP polishing of a semiconductor wafer is described that includes using a polishing pad on a platen/table with the polishing pad including a sub-pad containing pockets of magnetorheological fluid. The stiffness of the sub-pad is controlled by selectively applying a magnetic field at selective pockets containing magnetorheological fluid to change the viscosity of the magnetorheological fluid. The changing stiffness increases the polishing rate of the pad in the areas of the magnetic field.
展开▼
