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CMOS devices hardened against total dose radiation effects

机译:CMOS器件针对总剂量辐射效应进行了硬化

摘要

A CMOS or NMOS device has one or more n-channel FETs disposed on a substrate, the device being resistant to total dose radiation failures, the device further including a negative voltage source, for applying a steady negative back bias to the substrate of the n-channel FETs to mitigate leakage currents in the device, thereby mitigating total dose radiation effects. A method for operating a CMOS or NMOS device to resist total dose radiation failures, the device having one or more n-channel FETs disposed on a substrate, has the steps: (a) disposing the CMOS or NMOS device in a radiation environment, the radiation environment delivering a dose on the order of tens or hundreds of krad (Si) over the period of use of the CMOS device; and (b) applying a negative back bias to the substrate of the NMOS FETs, at a voltage for mitigating leakage currents about the n-channel FETs.
机译:CMOS或NMOS器件具有布置在衬底上的一个或多个n沟道FET,该器件抵抗总剂量辐射故障,该器件还包括负电压源,用于向n的衬底施加稳定的负背偏置。 -沟道FET以减轻装置中的泄漏电流,从而减轻总剂量辐射效应。一种用于操作CMOS或NMOS器件以抵抗总剂量辐射故障的方法,该器件具有布置在基板上的一个或多个n沟道FET,该方法具有以下步骤:(a)将CMOS或NMOS器件布置在辐射环境中,辐射环境在CMOS器件的使用期间提供数十或数百krad(Si)的剂量; (b)以减轻N沟道FET周围的泄漏电流的电压向NMOS FET的衬底施加负的反向偏压。

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