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METHOD AND SYSTEM FOR DECIDING AT LEAST DESIGN RULE OR PROCESS PARAMETER, AND MANUFACTURING METHOD OF SEMICONDUCTOR IC USING DECISION METHOD, AND SYSTEM FOR DECIDING AT LEAST ONE OF DESIGN RULE AND PROCESS PARAMETER
METHOD AND SYSTEM FOR DECIDING AT LEAST DESIGN RULE OR PROCESS PARAMETER, AND MANUFACTURING METHOD OF SEMICONDUCTOR IC USING DECISION METHOD, AND SYSTEM FOR DECIDING AT LEAST ONE OF DESIGN RULE AND PROCESS PARAMETER
PROBLEM TO BE SOLVED: To provide a method and a system which simultaneously decide optimal design rules and the optimal process parameters while reducing the chip area.;SOLUTION: A design rule (D.R,)/process parameter (P.P) decision system 2 is provided with a compaction means 8 which compacts design layout data based on a D.R. table, a chip size information acquisition means 10 which calculates chip size information of the compacted layout data, a shape information acquisition means 14 which predicts the finished shape of the compacted layout on a wafer according to the P.P, a comparison means 16 which compares the predicted finished shape with the compacted layout, a dangerous pattern information acquisition means 18 which extracts a dangerous pattern from the compacted layout based on a comparison result and a decision means 20 which decides at least one of the D.R. and the P.P. so that both of the chip size and the dangerous pattern satisfy prescribed evaluation conditions.;COPYRIGHT: (C)2004,JPO
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