首页> 外国专利> BONDING METHOD FOR CEMENTED CARBIDE MEMBER AND DIAMOND MEMBER, BONDING STRUCTURE, CUTTING BLADE CHIP FOR DRILLING TOOL, CUTTING BLADE MEMBER, AND DRILLING TOOL

BONDING METHOD FOR CEMENTED CARBIDE MEMBER AND DIAMOND MEMBER, BONDING STRUCTURE, CUTTING BLADE CHIP FOR DRILLING TOOL, CUTTING BLADE MEMBER, AND DRILLING TOOL

机译:硬质合金和金刚石部件的结合方法,结合结构,切削钻削刀片,切削刀片和钻削刀具

摘要

PROBLEM TO BE SOLVED: To provide a bonding method for increasing bonding strength for a member made of cemented carbide and a member made of diamond, a bonding structure, a cutting blade chip for drilling tool, a cutting blade member, and a drilling tool.;SOLUTION: The cutting blade chip used for the cutting blade of the drilling tool has a structure comprising a cutting blade body part 11 made of the cemented carbide (the cemented carbide member), the member 12 made of diamond supported by the cutting blade body part 11, and a metal layer 13 that is arranged between the cutting blade body part 11 and the diamond member 12 and diffusion-bonded with them respectively. The metal layer 13 is composed of one kind of metal among Ti, Zr and W, or an alloy made from two or more kinds among these metals.;COPYRIGHT: (C)2005,JPO&NCIPI
机译:解决的问题:提供一种用于增加由硬质合金制成的构件和由金刚石制成的构件的粘结强度的粘结方法,粘结结构,用于钻具的切削刀片碎片,切削刀片构件和钻具。 ;解决方案:用于钻具的切削刀片的切削刀片芯片具有这样的结构,该结构包括由硬质合金制成的切削刀片主体部分11(硬质合金构件),由切削刀片主体支撑的由金刚石制成的构件12部件11,金属层13和金属层13,金属层13分别布置在切割刀片主体部分11和金刚石构件12之间并与其扩散结合。金属层13由Ti,Zr和W中的一种金属或由这些金属中的两种以上构成的合金构成。版权所有:(C)2005,JPO&NCIPI

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