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Optimum bonding parameter determination method for wire bonder, involves determining maximum/global maximum values of sensor output, bond force and ultrasonic values by satisfying predefined criteria in set range
Optimum bonding parameter determination method for wire bonder, involves determining maximum/global maximum values of sensor output, bond force and ultrasonic values by satisfying predefined criteria in set range
The quantity (G) of electrical signal produced by a piezoelectric sensor, proportional to shear force exerted on corresponding connection point on a semiconductor chip, is determined while wire bonding is performed by varying bond force (FB) and ultrasonic variable (P). The maximum/global maximum values are determined for the three parameters by satisfying predefined criteria in the set range H.
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