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Laser drilling of oppositely chamfered through holes involves using incidence axis offset from normal at point of incidence, moving material and beam relative to each other on closed path
Laser drilling of oppositely chamfered through holes involves using incidence axis offset from normal at point of incidence, moving material and beam relative to each other on closed path
The method involves directing a laser beam with adequate energy to ablate the material along an axis of incidence and at a point of incidence on a first surface of the material, whereby the incidence axis is offset from the normal at the point of incidence, and moving the material and laser beam relative to each other on a closed path.
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