首页> 外国专利> DRAM has bonding pads arranged on east/west band on peripheral region along two opposing sides of DRAM and outermost power supply pads arranged near center of north/south band

DRAM has bonding pads arranged on east/west band on peripheral region along two opposing sides of DRAM and outermost power supply pads arranged near center of north/south band

机译：DRAM具有沿DRAM的两个相对侧布置在外围区域的东/西带上的焊盘和位于北/南带中心附近的最外层电源焊盘

页面导航

摘要
著录项
相似文献

摘要

The DRAM has bonding pads arranged on the east/west band on peripheral region along two opposing sides of the DRAM and outermost power supply pads (11,12) arranged near center of the north/south band.

机译：DRAM具有布置在沿DRAM的两个相对侧的外围区域上的东/西带上的接合焊盘和布置在北/南带的中心附近的最外侧的电源焊盘（11，12）。

著录项

公开/公告号DE10228544A1

专利类型
公开/公告日2003-05-15

原文格式PDF
申请/专利权人 MITSUBISHI DENKI K.K. TOKIO/TOKYO;
展开▼

申请/专利号DE2002128544
发明设计人 JINBO SHINICHI;TIAN ZENGCHENG;YAMAUCHI TADAAKI;YONETANI HIDEKI;NAGASAWA TSUTOMU;SUWA MAKOTO;MATSUMOTO JUNKO;OKAMOTO TAKEO;ISHIDA KOZO;
展开▼

申请日2002-06-26
分类号G11C7/00;
国家 DE
入库时间 2022-08-21 23:41:59

相似文献

专利