首页> 外国专利> Acoustic surface wave component has strip structures of thin film metallisation system as finger electrodes with strip structures partly or fully encased by thin film based on tantalum or silicon

Acoustic surface wave component has strip structures of thin film metallisation system as finger electrodes with strip structures partly or fully encased by thin film based on tantalum or silicon

机译:声表面波分量具有薄膜金属化系统的条状结构,作为指状电极,其条状结构部分或完全被基于钽或硅的薄膜包裹

摘要

The device has strip structures of a thin film metallisation system as finger electrodes in which the strip structures are partly or fully encased by a thin film based on tantalum or silicon. The thin film metallisation system can consist of a copper thin film system. It can consist of 20-80 atom per cent tantalum, 15-20 atom per cent silicon and 0-60 atom per cent nitrogen. AN Independent claim is also included for the following: a method of manufacturing an inventive device.
机译:该装置具有薄膜金属化系统的条状结构作为指状电极,其中条状结构部分或全部被基于钽或硅的薄膜包围。薄膜金属化系统可以由铜薄膜系统组成。它可以由20-80原子百分比的钽,15-20原子百分比的硅和0-60原子百分比的氮组成。还包括以下内容的独立权利要求:一种制造本发明装置的方法。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号