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Control of wafer temperature uniformity in rapid thermal processing using an optimal iterative learning control technique
Control of wafer temperature uniformity in rapid thermal processing using an optimal iterative learning control technique
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机译：使用最佳迭代学习控制技术控制快速热处理中的晶圆温度均匀性
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摘要
PURPOSE: A method for controlling the temperature uniformity of a wafer is provided to guarantee the temperature uniformity, by using an optimum input for reducing temperature variations in various positions inside the wafer. CONSTITUTION: A recognizing unit forms a time-varying linear space model from an input/output variable in a previous process. An estimating unit uses the time-varying linear space model made by the recognizing unit and obtains an output error from now on by using a reference output locus, a previous entire input/output variable and a whole input/output variable until the present. A calculating unit makes an object function by using the output error and calculates an input variable locus for minimizing the object function. A process control unit controls a target process according to the input variable locus obtained by the calculating unit.
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