首页> 外国专利> Silicon oxide layer reduced in dangling bonds through treatment with hypofluorous acid process for growing silicon oxide layer and method for deactivating dangling bonds therein

Silicon oxide layer reduced in dangling bonds through treatment with hypofluorous acid process for growing silicon oxide layer and method for deactivating dangling bonds therein

机译:通过用次氟酸处理的生长硅氧化物层的悬空键减少的悬空键的氧化硅层和使悬空键失活的方法

摘要

PURPOSE: To provide a silicon insulation film, in which the resistance against charge injection is high, without structural failures due to excessive fluorine atoms and to provide, such a silicon insulation film. CONSTITUTION: The silicon insulation film has a silicon dangling bond, terminated by the termination with fluorine atom and termination with a hydroxy group. The method of manufacturing the silicon insulation film has a termination step of performing termination process separately on the fluorine atom and the hydroxy group. The method of manufacturing the silicon insulation film has a step of terminating the silicon dangling bond, by using hypofluoric acid as a reactive species. The method of terminating the silicon dangling bond terminates the silicon dangling bond of the silicon insulation film of the silicon insulation film, by using hypofluorine oxyde.
机译:用途:提供一种硅绝缘膜,其中其对电荷注入的抵抗力高,而不会由于过量的氟原子而导致结构破坏,并且提供了这样的硅绝缘膜。组成:硅绝缘膜具有硅悬键,其末端为氟原子末端,且末端为羟基。硅绝缘膜的制造方法具有终止步骤,该终止步骤是对氟原子和羟基分别进行终止处理。硅绝缘膜的制造方法具有通过使用次氟作为反应性种来终止硅悬空键的步骤。终止硅悬挂键的方法通过使用次氟氧化物终止硅绝缘膜的硅绝缘膜的硅悬挂键。

著录项

  • 公开/公告号KR20030009202A

    专利类型

  • 公开/公告日2003-01-29

    原文格式PDF

  • 申请/专利权人 NEC CORPORATION;

    申请/专利号KR20020042214

  • 发明设计人 MIYAMOTO YOSHIYUKI;

    申请日2002-07-18

  • 分类号H01B3/46;

  • 国家 KR

  • 入库时间 2022-08-21 23:47:51

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