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Silicon oxide layer reduced in dangling bonds through treatment with hypofluorous acid process for growing silicon oxide layer and method for deactivating dangling bonds therein
Silicon oxide layer reduced in dangling bonds through treatment with hypofluorous acid process for growing silicon oxide layer and method for deactivating dangling bonds therein
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机译:通过用次氟酸处理的生长硅氧化物层的悬空键减少的悬空键的氧化硅层和使悬空键失活的方法
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摘要
PURPOSE: To provide a silicon insulation film, in which the resistance against charge injection is high, without structural failures due to excessive fluorine atoms and to provide, such a silicon insulation film. CONSTITUTION: The silicon insulation film has a silicon dangling bond, terminated by the termination with fluorine atom and termination with a hydroxy group. The method of manufacturing the silicon insulation film has a termination step of performing termination process separately on the fluorine atom and the hydroxy group. The method of manufacturing the silicon insulation film has a step of terminating the silicon dangling bond, by using hypofluoric acid as a reactive species. The method of terminating the silicon dangling bond terminates the silicon dangling bond of the silicon insulation film of the silicon insulation film, by using hypofluorine oxyde.
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